Enhanced air fin cooling arrangement for a hermetically sealed m

Details Enhanced air fin cooling arrangement for a hermetically sealed m Enhanced air fin cooling arrangement for a hermetically sealed m

1989-01-13

1990-07-17

Davis, Jr., Albert W.

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

16510414, 16510421, 361385, F28D 1502, H01L 2342

Patent

active

049415301

ABSTRACT:
A modular reflux cooling plate (10) having a condenser region (11) above the boiling channels (12) or above and below (11,24) the region (11), boiling channels (12) and downcomers (16) which effect reflux cooling of electrical power modules used in aircraft and the like. Air flow fins (18) are arranged adjacent the condenser (11) or condensers (11,24) and the boiling channels (12) to effect cooling of a coolant vapor which has entered the condenser (11) after being boiled from a liquid state in the boiling channels (12) as a result of the heat generated by one or more power modules affixed to an end plate (14) by any suitable means and to provide a parallel heat transfer path which shares the heat transfer task with the reflux cooling during normal system operation and which provides emergency heat transfer when reflux cooling is not available.

REFERENCES:
patent: 2883591 (1959-04-01), Camp
patent: 3100969 (1963-08-01), Elfving
patent: 3324667 (1967-06-01), Muller
patent: 4635709 (1987-01-01), Altoz
patent: 4727454 (1988-02-01), Neidig
patent: 4727455 (1988-02-01), Neidig

Affiliated with

Also associated with

Rating

Enhanced air fin cooling arrangement for a hermetically sealed m does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Enhanced air fin cooling arrangement for a hermetically sealed m, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Enhanced air fin cooling arrangement for a hermetically sealed m will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-90784