Substrate retaining ring

Details Substrate retaining ring Substrate retaining ring

1997-12-30

2000-09-12

Lund, Jeffrie R

Abrading

Machine

Rotary tool

451285, 451287, 451288, 156345, C23F 102, B24B 500, B24B 2900

Patent

active

061169927

ABSTRACT:
A retaining ring is configured for use with an apparatus for polishing a substrate. The substrate has upper and lower faces and a perimeter. The apparatus has a movable polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retaining ring has a retaining face for engaging and retaining the substrate against lateral movement and a bottom face for contacting the polishing surface of the polishing pad. The bottom face of the retaining ring extends downward from an inner portion adjacent the retaining face to a lowermost portion radially outboard of the retaining face.

REFERENCES:
patent: 5205082 (1993-04-01), Shendon et al.
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5605487 (1997-02-01), Hileman et al.
patent: 5664988 (1997-09-01), Stroupe et al.
patent: 5762544 (1998-06-01), Zuniga et al.
Ali, et al., Investigating the Effect of Secondary Platen Pressure on Post-Chemical-Mechanical Planarization Cleaning, Microcontamination, pp. 45-50, Oct. 1994.
Kolenkow and Nagahara, Chemical-Mechanical Wafer Polishing and Planarization in Batch Systems, Solid State Technology, pp. 112-114, Jun. 1992.
Scott R. Runnels, Modeling the Effect of Polish Pad Deformation on Wafer Surface Stress Distributions During Chemical-Mechanical Polishing.
Yuan, et al., A Novel Wafer Carrier Ring Design Minimizes Edge Over-Polishing Effects for Chemical Mechanical Polishing, Jun. 27-29 1995 VMIC Conference, 1995 ISMIC 104/95/525, pp. 525-527.

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