Enhanced adhesion strength between mold resin and polyimide

Details Enhanced adhesion strength between mold resin and polyimide Enhanced adhesion strength between mold resin and polyimide

2005-04-26

2005-04-26

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S129000

Reexamination Certificate

active

06884662

ABSTRACT:
A new method is provided for the interface between a stress relieve interface layer of polyimide and a thereover created layer of mold compound. The invention provides for creating a pattern in the stress relieve layer of polyimide before the layer of mold compound is formed over the stress relieve layer of polyimide.

REFERENCES:
patent: 5048179 (1991-09-01), Shindo et al.
patent: 5883001 (1999-03-01), Jin et al.
patent: 5937279 (1999-08-01), Sawada et al.
patent: 5940277 (1999-08-01), Farnworth et al.
patent: 6074895 (2000-06-01), Dery et al.
patent: 6191023 (2001-02-01), Chen
patent: 6277672 (2001-08-01), Ho
patent: 6294454 (2001-09-01), Koike
patent: 6329288 (2001-12-01), Tokushige et al.
patent: 6489237 (2002-12-01), Wu
patent: 6593649 (2003-07-01), Lin et al.

Affiliated with

Also associated with

Rating

Enhanced adhesion strength between mold resin and polyimide does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Enhanced adhesion strength between mold resin and polyimide, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Enhanced adhesion strength between mold resin and polyimide will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3370821