Enhanced adhesion strength between mold resin and polyimide

Details Enhanced adhesion strength between mold resin and polyimide Enhanced adhesion strength between mold resin and polyimide

2008-06-24

2008-06-24

Lebentritt, Michael S. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257SE21508

Reexamination Certificate

active

07390697

ABSTRACT:
A new method is provided for the interface between a stress relieve interface layer of polyimide and a thereover created layer of mold compound. The invention provides for creating a pattern in the stress relieve layer of polyimide before the layer of mold compound is formed over the stress relieve layer of polyimide.

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