Abrasive tool making process – material – or composition – With inorganic material
Reexamination Certificate
2006-01-05
2008-09-02
Deo, Duy-Vu N (Department: 1792)
Abrasive tool making process, material, or composition
With inorganic material
C051S308000, C051S309000, C438S690000, C438S691000, C438S692000, C438S693000
Reexamination Certificate
active
07419519
ABSTRACT:
An abrasive composition comprising composite non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The composite particles individually contain at least one nonpolymeric organic component and at least one other chemical component different from the at least one nonpolymeric organic component. The slurry composition can be vastly simplified if one or more of the components are incorporated into the abrasive particles. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.
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Bian Guomin
Bian Henry
Bundi Deenesh
Cheemalapati Krishnayya
Duvvuru Vivek
Birch & Stewart Kolasch & Birch, LLP
Deo Duy-Vu N
Dynea Chemicals Oy
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