Engineered non-polymeric organic particles for chemical...

Abrasive tool making process – material – or composition – With inorganic material

Reexamination Certificate

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Details

C051S308000, C051S309000, C438S690000, C438S691000, C438S692000, C438S693000

Reexamination Certificate

active

07419519

ABSTRACT:
An abrasive composition comprising composite non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The composite particles individually contain at least one nonpolymeric organic component and at least one other chemical component different from the at least one nonpolymeric organic component. The slurry composition can be vastly simplified if one or more of the components are incorporated into the abrasive particles. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.

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