Endpoint detection with multiple light beams

Details Endpoint detection with multiple light beams Endpoint detection with multiple light beams

2006-08-08

2006-08-08

Rose, Robert A. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S288000

Reexamination Certificate

active

07086929

ABSTRACT:
A chemical mechanical polishing apparatus includes two optical systems which are used serially to determine polishing endpoints. The first optical system includes a first light source to generate a first light beam which impinges on a surface of the substrate, and a first sensor to measure light reflected from the surface of the substrate to generate a measured first interference signal. The second optical system includes a second light source to generate a second light beam which impinges on a surface of the substrate and a second sensor to measure light reflected from the surface of the substrate to generate a measured second interference signal. The second light beam has a wavelength different from the first light beam.

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