Endpoint detection for non-transparent polishing member

Details Endpoint detection for non-transparent polishing member Endpoint detection for non-transparent polishing member

2005-09-13

2005-09-13

Thomas, David B. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With indicating

C451S006000, C451S059000, C451S288000, C451S296000

Reexamination Certificate

active

06942546

ABSTRACT:
A sensing apparatus for detecting a processing endpoint of a multi-layer semiconductor wafer includes a light source to emit light against a surface of the semiconductor wafer, a color sensor to sense a reflection color from the surface of the semiconductor wafer in response to the incident light and to generate a sensor signal, and a decision circuit coupled to the color sensor and configured to decide whether the wafer processing endpoint has been reached based at least in part on the sensor signal. In another embodiment, a sensing apparatus is coupled to a movable structure to position the sensing apparatus to sense the surface of the semiconductor wafer.

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