Endpoint and uniformity determinations in material layer process

Details Endpoint and uniformity determinations in material layer process Endpoint and uniformity determinations in material layer process

1992-06-09

1994-05-03

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156640, 427 9, 427 10, G01N 2100

Patent

active

053084470

ABSTRACT:
Techniques of monitoring and controlling removal or forming of layers of material, such as employed in the manufacture of flat panel displays and integrated circuit wafers. Examples of material removal include the development of a photoresist layer and etching of layers of other material according to a pattern across the surface of the layer. The material removal process is terminated in response to detecting when breakthrough occurs in a preselected number of individual regions across the surface of the layer. A measure of uniformity of processing across the layer surface is obtained from monitoring removal of material in such individual surface regions, and can be used to control the process to improve such uniformity.

REFERENCES:
patent: 4496425 (1985-01-01), Kuyel
patent: 4611919 (1986-09-01), Brooks, Jr. et al.
patent: 4859277 (1989-08-01), Barna et al.
patent: 5002627 (1991-03-01), Scheithauer et al.
patent: 5147520 (1992-09-01), Bobbio
XINIX Product Brochure, entitled "Wet Process Endpoint Controller, 2200 Single Station" (Jun. 1989).
XINIX Product Brochure, entitled "Wet Process Endpoint Controller, 2300-2400" (Jun., 1990).

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