End point polishing apparatus and polishing method

Details End point polishing apparatus and polishing method End point polishing apparatus and polishing method

1997-09-26

1999-03-02

Morgan, Eileen P.

Abrading

Precision device or process - or with condition responsive...

With indicating

451 11, 451 41, 451285, 451288, 438691, 438692, B24B 4900

Patent

active

058762655

ABSTRACT:
A polishing apparatus of the present invention comprises an amplifier for amplifying a first signal being input from the vibration detecting device attached on a second surface plate to then output a second signal, a gain indicator for determining unsuitableness of a gain of the amplifier based on a magnitude of the second signal output from the amplifier and then indicating correction of said gain, a gain adjuster for adjusting the gain of the amplifier based on a gain correction signal output from the gain indicator, a polishing end-point analyzing portion for determining an end-point of polishing based on change in the second signal, and a control portion for terminating drive of the first surface plate based on a polishing end-point signal being output from the polishing end-point analyzing portion.

REFERENCES:
patent: 5222329 (1993-06-01), Yu
patent: 5245794 (1993-09-01), Salugsugan
patent: 5399234 (1995-03-01), Yu et al.
patent: 5643046 (1997-07-01), Ichiro et al.
patent: 5667424 (1997-09-01), Yang

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