End point detection with imaging matching in semiconductor...

Details End point detection with imaging matching in semiconductor... End point detection with imaging matching in semiconductor...

2005-08-16

2005-08-16

Toatley, Jr., Gregory J. (Department: 2877)

Optics: measuring and testing

By light interference

For dimensional measurement

Reexamination Certificate

active

06930782

ABSTRACT:
An end point detection system may compare a production image developed during processing of production semiconductor wafer with a reference image. The reference image is representative of a desired state of processing of the production semiconductor wafer. The reference image is determined by processing a reference semiconductor wafer. The reference semiconductor wafer may be part of a wafer group of similar wafers that includes the production semiconductor wafer. The end point detection system may dynamically develop the production image during processing of the production semiconductor wafer. Indication may be provided by the end point detection system when the reference image and the production image are substantially similar.

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