End point detection in time division multiplexed etch processes

Details End point detection in time division multiplexed etch processes End point detection in time division multiplexed etch processes

2006-01-03

2006-01-03

Goudreau, George A. (Department: 1763)

Semiconductor device manufacturing: process

Including control responsive to sensed condition

Optical characteristic sensed

C438S016000, C438S695000, C438S714000, C216S060000, C216S067000

Reexamination Certificate

active

06982175

ABSTRACT:
An improved method for determining endpoint of a time division multiplexed process by monitoring an identified region of a spectral emission of the process at a characteristic process frequency. The region is identified based upon the expected emission spectra of materials used during the time division multiplexed process. The characteristic process frequency is determined based upon the duration of the steps in the time division multiplexed process. Changes in the magnitude of the monitored spectra indicate the endpoint of processes in the time division multiplexed process and transitions between layers of materials.

REFERENCES:
patent: 4491499 (1985-01-01), Jerde et al.
patent: 4985114 (1991-01-01), Okudaira et al.
patent: 5308414 (1994-05-01), O'Neill et al.
patent: 5450205 (1995-09-01), Sawin et al.
patent: 5501893 (1996-03-01), Laermer et al.
patent: 5658423 (1997-08-01), Angell et al.
patent: 6021215 (2000-02-01), Kornblit et al.
patent: 6104487 (2000-08-01), Buck et al.
patent: 6200822 (2001-03-01), Becker et al.
patent: 6455437 (2002-09-01), Davidow et al.
patent: 2001-044171 (2001-02-01), None

Affiliated with

Also associated with

Rating

End point detection in time division multiplexed etch processes does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with End point detection in time division multiplexed etch processes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and End point detection in time division multiplexed etch processes will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3582409