End-point detection apparatus

Details End-point detection apparatus End-point detection apparatus

2006-04-18

2006-04-18

Rose, Robert A. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Controlling temperature

C451S307000

Reexamination Certificate

active

07029369

ABSTRACT:
An apparatus is provided for polishing a substrate. The apparatus includes a polishing pad configured to traverse from at least a first point to a second point. A first sensor is located near the first point and oriented so as to sense an incoming temperature of the polishing pad. A second sensor is located near the second point and oriented so as to sense an outgoing temperature of the polishing pad. A difference between the incoming temperature and the outgoing temperature is then used to determine endpoint of a polishing operation.

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patent: 6224461 (2001-05-01), Boehm, Jr. et al.
patent: 6325706 (2001-12-01), Krusell et al.
patent: 6375540 (2002-04-01), Mikhaylich et al.

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