Encapsulation package for a semiconductor element

Details Encapsulation package for a semiconductor element Encapsulation package for a semiconductor element

1974-09-17

1976-03-23

Miller, Jr., Stanley D.

357 81, 357 84, H01L 2302, H01L 2504

Patent

active

039464288

ABSTRACT:
A semiconductor package device characterized by improved operation at ultra-high frequencies and by improved heat dissipation, includes an auxiliary metal stud mounted on a metal substrate. A semiconductor element, such as a field-effect transistor or bipolar transistor, is mounted on the auxiliary stud and has at least one electrode thereof electrically connected to the stud.

REFERENCES:
patent: 3651434 (1972-03-01), McGeough et al.
patent: 3701049 (1972-10-01), Van Iperen et al.
patent: 3828228 (1974-08-01), Wong et al.

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