Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-12-13
2005-12-13
Cuneo, Kamand (Department: 2827)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S613000, C438S615000, C438S118000, C257S697000
Reexamination Certificate
active
06974765
ABSTRACT:
Solder joints coupling pins to a microelectronic package substrate are enshrouded with an encapsulation material. In this manner, pin movement is limited even if the pin solder subsequently melts.
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Cuneo Kamand
Schwegman Lundberg Woessner & Kluth P.A.
Thai Luan
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