Encapsulation of pin solder for maintaining accuracy in pin...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S613000, C438S615000, C438S118000, C257S697000

Reexamination Certificate

active

06974765

ABSTRACT:
Solder joints coupling pins to a microelectronic package substrate are enshrouded with an encapsulation material. In this manner, pin movement is limited even if the pin solder subsequently melts.

REFERENCES:
patent: 4233620 (1980-11-01), Darrow et al.
patent: 4835344 (1989-05-01), Iyogi et al.
patent: 5196251 (1993-03-01), Bakhru et al.
patent: 5288944 (1994-02-01), Bronson et al.
patent: 5303862 (1994-04-01), Bross et al.
patent: 5943217 (1999-08-01), Hashimoto
patent: 6088914 (2000-07-01), Variot et al.
patent: 6297560 (2001-10-01), Capote et al.
patent: 0631311 (1994-12-01), None
patent: 09-045844 (1997-02-01), None
patent: 09-102560 (1997-04-01), None
patent: 09-129769 (1997-05-01), None
patent: 09-129778 (1997-05-01), None

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