Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-02-12
2008-09-02
Zarneke, David A (Department: 2891)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C257SE51020, C257SE33056, C257SE33058
Reexamination Certificate
active
07419842
ABSTRACT:
A method of encapsulating a device is disclosed. Spacer particles are randomly located in a device region to prevent a cap mounted on the substrate from contacting the active components when pressure is applied to the cap, thereby protecting the active components from damage. The spacer particles comprise a base and an upper portion, the base being at least equal to or wider than the upper portion.
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Auch Mark
Chua Soo Jin
Guenther Ewald
Agency for Science Technology and Research
Fish & Richardson P.C.
Osram GmbH
Zarneke David A
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