Encapsulation of electroluminescent devices with shaped spacers

Details Encapsulation of electroluminescent devices with shaped spacers Encapsulation of electroluminescent devices with shaped spacers

2008-09-02

2008-09-02

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C257SE51020, C257SE33056, C257SE33058

Reexamination Certificate

active

11674098

ABSTRACT:
A method of encapsulating a device is disclosed. Spacer particles are randomly located in a device region to prevent a cap mounted on the substrate from contacting the active components when pressure is applied to the cap, thereby protecting the active components from damage. The spacer particles comprise a base and an upper portion, the base being at least equal to or wider than the upper portion.

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