Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2007-06-12
2007-06-12
Andujar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Reexamination Certificate
active
10955083
ABSTRACT:
A packaged micromechanical device (100) having a blocking material (116) encapsulating debris-generating regions thereof. The blocking material (116) prevents the generation of debris that could interfere with the operation of the micromechanical device (100). Debris-generating regions of the device (100), including debris-creating sidewalls and any debris-harboring cavities, as well as electrical connections (108) linking the device (100) to the package substrate (102) are encapsulated by the blocking material (116). The blocking material (116) avoids contact with any debris-intolerant regions (118) of the device (100). A package lid (124), which is glass in the case of many DMD packages, seals the device (100) in a package cavity (120).
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Fisher Edward C.
Latham Lawrence T.
Andujar Leonardo
Brady III Wade James
Brill Charles A.
Soderholm Krista
Telecky , Jr. Frederick J.
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