Encapsulation for particle entrapment

Details Encapsulation for particle entrapment Encapsulation for particle entrapment

2005-01-11

2005-01-11

Thai, Luan (Department: 2827)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S048000, C438S054000, C438S055000, C438S064000

Reexamination Certificate

active

06841412

ABSTRACT:
A packaged micromechanical device (100) having a blocking material (116) encapsulating debris-generating regions thereof. The blocking material (116) prevents the generation of debris that could interfere with the operation of the micromechanical device (100). Debris-generating regions of the device (100), including debris-creating sidewalls and any debris-harboring cavities, as well as electrical connections (108) linking the device (100) to the package substrate (102) are encapsulated by the blocking material (116). The blocking material (116) avoids contact with any debris-intolerant regions (118) of the device (100). A package lid (122), which is glass in the case of many DMD packages, seals the device (100) in a package cavity (120).

REFERENCES:
patent: 4047045 (1977-09-01), Paxton et al.
patent: 5622873 (1997-04-01), Kim et al.
patent: 5644169 (1997-07-01), Chun
patent: 5817540 (1998-10-01), Wark
patent: 5962810 (1999-10-01), Glenn
patent: 6117705 (2000-09-01), Glenn et al.
patent: 6147790 (2000-11-01), Meier et al.
patent: 6169328 (2001-01-01), Mitchell et al.

Affiliated with

Also associated with

Rating

Encapsulation for particle entrapment does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Encapsulation for particle entrapment, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Encapsulation for particle entrapment will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3428036