Encapsulation for an electrical component and method for...

Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate

Reexamination Certificate

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C427S554000, C427S558000, C427S595000, C427S596000, C427S058000, C427S240000, C427S261000, C427S264000, C427S265000, C427S271000, C427S352000, C427S407100, C427S425000

Reexamination Certificate

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06984421

ABSTRACT:
Encapsulating a component structure includes applying a fluid, light-sensitive first reactive resin layer to a surface of a component substrate containing the component structure, exposing and developing the first reactive resin layer so as to form a frame structure that encloses the component structure, covering the frame structure with an auxiliary foil, applying a second reactive resin layer to a surface of the auxiliary foil so as to form ceiling structures on the surface of the auxiliary foil, at least one of the ceiling structures making a seal with the frame structure, and removing the auxiliary foil in areas between ceiling structures.

REFERENCES:
patent: 5729185 (1998-03-01), Johnson et al.
patent: 5831369 (1998-11-01), Furbacher et al.
patent: 5920142 (1999-07-01), Onishi et al.
patent: 6136175 (2000-10-01), Stelzl et al.
patent: 6492194 (2002-12-01), Bureau et al.
patent: 0 794 616 (1997-09-01), None
patent: 0 805 552 (1997-11-01), None
patent: 2000-165192 (2000-06-01), None
patent: WO 97/45955 (1997-12-01), None
patent: WO 00/00961 (2000-01-01), None

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