Encapsulation and methods thereof

Details Encapsulation and methods thereof Encapsulation and methods thereof

2006-03-30

2009-12-15

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S081000, C257S099000, C257S717000, C257S719000, C257S722000, C257S723000, C257SE25021, C062S003200, C062S003700

Reexamination Certificate

active

07633154

ABSTRACT:
The invention discloses an encapsulation comprising a metal substrate, a PCB on the metal substrate, a thermo-electric element in and/or on the PCB, and an LED on the thermo-electric element. Encapsulating methods are also provided by the invention.

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patent: WO-2005/111715 (2005-11-01), None

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