Encapsulating method of substrate based electronic device

Details Encapsulating method of substrate based electronic device Encapsulating method of substrate based electronic device

1997-12-08

1999-10-05

Ortiz, Angela

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

26427217, 264276, 2643284, B29C 7070, B29C 4502

Patent

active

059619120

ABSTRACT:
An encapsulating method of a substrate-based electronic device of the present invention comprises:

REFERENCES:
patent: H1654 (1997-06-01), Rounds
patent: 5098626 (1992-03-01), Pas
patent: 5151276 (1992-09-01), Sato et al.
patent: 5542171 (1996-08-01), Juskey et al.
patent: 5543159 (1996-08-01), Iltgen
patent: 5635671 (1997-06-01), Freyman et al.
patent: 5744084 (1998-04-01), Chia et al.
patent: 5779958 (1998-07-01), Nishihara et al.

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