Encapsulated surface acoustic wave component and method of...

Details Encapsulated surface acoustic wave component and method of... Encapsulated surface acoustic wave component and method of...

2005-02-08

2005-02-08

Trinh, Michael (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S048000, C438S458000

Reexamination Certificate

active

06852561

ABSTRACT:
The invention relates to a new type of encapsulated surface acoustic wave component and to a method for the batch production of such components.The component comprises a surface acoustic wave device on the surface of a substrate. The encapsulation package furthermore comprises the substrate, a first layer located on the substrate and hollowed out locally at least at the level of the active surface of the surface acoustic wave device, a printed circuit covering entire first layer and conductive via holes going through the unit formed by the first layer and the printed circuit so as to provide for the electrical connection of the surface acoustic wave device from the exterior.

REFERENCES:
patent: 4734608 (1988-03-01), Takoshima
patent: 5359494 (1994-10-01), Morimoto
patent: 5459368 (1995-10-01), Onishi et al.
patent: 5699027 (1997-12-01), Tsuji
patent: 5821665 (1998-10-01), Onishi et al.
patent: 5920142 (1999-07-01), Onishi et al.
patent: 5969461 (1999-10-01), Anderson et al.
patent: 6078123 (2000-06-01), Tanaka et al.
patent: 6078229 (2000-06-01), Funada et al.
patent: 6150748 (2000-11-01), Fukiharu
patent: 6181015 (2001-01-01), Gotoh et al.
patent: 6514789 (2003-02-01), Denton et al.
patent: 39 37 870 (1991-05-01), None
patent: 2 171 850 (1986-09-01), None

Affiliated with

Also associated with

Rating

Encapsulated surface acoustic wave component and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Encapsulated surface acoustic wave component and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Encapsulated surface acoustic wave component and method of... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3466657