Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1992-09-29
1994-02-08
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
257667, 257670, H01L 2348, H01L 2944, H01L 2952, H01L 2960
Patent
active
052851044
ABSTRACT:
A lead frame and a circuit board for mounting thereon a semiconductor element for encapsulating a semiconductor device by transfer molding comprising an electrically conductive lead portions connected to the frame portion and a bridge member connecting the lead portions together. Each lead portion is partially encapsulated by a mold resin and divided into inner and outer lead portions by the resin boundary. The electrically insulating and heat-resisting bridge member is disposed at a position corresponding to the outer surface of the mold resin and having a thickness at least equal to that of the lead portions. Therefore, the spaces between the lead portions are completely closed by the bridge member, so that no burr is formed between the leads and leads are mechanically supported while being electrically insulated from each other, whereby a fine pitch lead frame can easily realized. A semiconductor device in which the lead frame or the circuit board is used is also disclosed.
REFERENCES:
patent: 4942455 (1990-07-01), Shinohara
patent: 5031022 (1991-07-01), Yamamoto et al.
Kondo Mitsuhiro
Watanabe Osamu
Clark Sheila V.
Ibiden Co. Ltd.
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