Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate
2008-01-08
2008-01-08
Chambliss, Alonzo (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
C257S693000, C257S701000, C438S125000
Reexamination Certificate
active
10944808
ABSTRACT:
Substrate for electrical devices and methods of manufacturing such substrate are disclosed. An embodiment for the substrate comprised of an insulator and a plurality of conductive elements, wherein the insulator having a recess. The conductive elements embedded in the insulator. The conductive elements extend from the insulator surface to the recess. There are two portions of the conductive elements for electrical connection respectively, wherein a portion of conductive element may protrude the insulator surface for electrical connection. In this manner, solder balls are not needed. Moreover, the substrate of the present invention may also comprise an adhesive mean, which is between the conductive elements and the insulator. In addition, the substrate may further comprise a submember such as a chip, heat spreader etc., and the present invention may be capable of affording a thinner electrical device thickness, enhanced reliability, and a decreased cost in production.
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Bacon & Thomas PLLC
Chambliss Alonzo
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