Encapsulated integrated circuit packaging

Details Encapsulated integrated circuit packaging Encapsulated integrated circuit packaging

1997-12-12

1999-11-23

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

438106, 438118, 438121, H01L 2144, H01L 2148, H01L 2150

Patent

active

059899417

ABSTRACT:
An encapsulated integrated circuit package uses a heat dissipating dam which is secured about the die to the die support. A dam constrains the outward movement of liquid glob top material during the manufacturing process. In addition, the dam provides heat dissipating properties for the integrated circuit package and may improve the structural integrity of the package as well. The dam may be efficiently applied to the die support using automated techniques, such as adhesive tape bonding.

REFERENCES:
patent: 5441918 (1995-08-01), Morisaki et al.
patent: 5696033 (1997-12-01), Kinsman

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