Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1992-06-30
1994-05-17
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174 522, 257788, H05K 702, H01L 2328
Patent
active
053133650
ABSTRACT:
An encapsulated electronic package (10) is made by bonding one or more semiconductor devices or integrated circuits (16) to a printed circuit board with an adhesive (14), and covering with a glob top encapsulant (15). The printed circuit board has a metal circuit pattern (12) on one side, and, optionally, solder pads (27) on the second side. The glob top encapsulant covers the integrated circuit, portions of the metal circuit pattern, and portions of the printed circuit board surface. The printed circuit board, the adhesive, and the encapsulant are all made from the same type of resin. In the preferred embodiment of the invention, the resin used to make the printed circuit board, the adhesive, and the encapsulant is an organosilicon polymer comprised substantially of alternating polycyclic hydrocarbon residues and cyclic polysiloxane or siloxysilane residues linked through carbon-silicon bonds.
REFERENCES:
patent: 4278784 (1981-07-01), Wong
patent: 4900779 (1990-02-01), Leibfried
patent: 4902731 (1990-02-01), Leibfried
patent: 4961105 (1990-10-01), Yamamoto
Dr. John K. Bard and Dr. Julia S. Burnier, Hercules Incorporated, Wilmington, Delaware, article entitled "New Low Dielectric Constant Moisture Resistant Resin Technology for High Speed/High Frequency Circuit Board Applications".
Gold Glenn E.
Juskey Frank J.
Pennisi Robert W.
Urbish Glenn F.
Dorinski Dale W.
Ledynh Bot
Motorola Inc.
Picard Leo P.
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