Embossing processes for substrate imprinting, structures...

Details Embossing processes for substrate imprinting, structures... Embossing processes for substrate imprinting, structures...

2007-06-12

2007-06-12

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

C257SE21273

Reexamination Certificate

active

10815561

ABSTRACT:
A mounting substrate includes an imprinted structure on one side for containing electrical bumps. The imprinted structure is imprinted and also cured under conditions that allow retention of significant features of the cured polymer film. A chip package is also made of the imprinted structure. A computing system is also disclosed that includes the imprinted structure.

REFERENCES:
patent: 6538333 (2003-03-01), Kong
patent: 6730617 (2004-05-01), Carter
patent: 6756294 (2004-06-01), Chen et al.
patent: 6897089 (2005-05-01), Farnworth
patent: 2002/0160598 (2002-10-01), Kong
patent: 2003/0203649 (2003-10-01), Carter
patent: 2004/0142575 (2004-07-01), Brewer
patent: 2004/0173890 (2004-09-01), Moriizumi
patent: 2004/0207081 (2004-10-01), Wood et al.
patent: 2004/0256734 (2004-12-01), Farnworth et al.
patent: 2005/0106855 (2005-05-01), Farnworth

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