Embossed semiconductor fabrication parts

Coating apparatus – Gas or vapor deposition

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Details

20429811, 118715, C23C 1400, C23C 1600

Patent

active

061622974

ABSTRACT:
A semiconductor fabrication equipment component which is exposed to a film layer fabrication environment exhibits a surface which is embossed with a pattern to provide an enhanced surface area for particle retention. The component is fabricatable using numerous embossing techniques, including knurling. The embossed surface provides the enhanced surface area without imposing a particle load on the treated part.

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New Collegiate Dictionary, G. & C. Merriam Company, p. 639, 1975.

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