Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent
1994-06-20
1996-03-05
Limanek, Robert P.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
257792, 257795, 257700, 361729, 361771, 361783, H01L 2329, H01L 2314, H05K 710
Patent
active
054970334
ABSTRACT:
Substrate material is molded directly to semiconductor chips and other electrical components that are positioned for integrated circuit module fabrication. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A mold form is positioned around the chips. Substrate molding material is added within the mold form, and the substrate molding material is then hardened. A dielectric layer having vias aligned with predetermined ones of the contact pads and having an electrical conductor extending through the vias is situated on the hardened substrate molding material and the faces of the chips. A thermal plug may be affixed to the backside of a chip before substrate molding material is added. A connector frame may be placed on the adhesive layer before substrate molding material is added. A dielectric layer may be placed over the backsides of the chips before the substrate molding material is added to enhance repairability. A portion of the chips and substrate molding material may be removed after the substrate molding material is hardened.
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Cole Herbert S.
Daum Wolfgang
Fillion Raymond A.
Gdula Michael
Wildi Eric J.
Hardy David B.
Krauss Geoffrey H.
Limanek Robert P.
Martin Marietta Corporation
Rees Brian J.
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