Embedded passive component network substrate fabrication method

Details Embedded passive component network substrate fabrication method Embedded passive component network substrate fabrication method

2011-06-14

2011-06-14

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000, C029S840000, C029S852000, C438S238000, C438S381000

Reexamination Certificate

active

07958626

ABSTRACT:
A method of forming an embedded passive component network substrate includes providing a first carrier with a first dielectric layer and patterning the first dielectric layer to form a first patterned dielectric layer including circuit pattern artifacts. A first etch stop layer is plated within the circuit pattern artifacts. A first conductor layer is plated on the first etch stop layer and within the circuit pattern artifacts. The first etch stop layer and the first conductor layer form a first etch stop metal protected circuit pattern comprising a passive component embedded with the first patterned dielectric layer.

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