Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2006-10-31
2006-10-31
Zarneke, David A. (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S734000, C257S787000, C174S260000, C029S840000, C327S595000, C327S603000, C361S437000, C361S760000, C700S121000
Reexamination Certificate
active
07129584
ABSTRACT:
A flexible film interposer for stacking a flip chip semiconductor die onto a second (bottom) semiconductor die, semiconductor devices and stacked die assemblies that incorporate the flexible film interposer, and methods of fabricating the devices and assemblies are provided. The incorporation of the flexible film interposer achieves densely packaged semiconductor devices, without the need for a redistribution layer (RDL).
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Micro)n Technology, Inc.
Whyte Hirschboeck Dudek S.C.
Zarneke David A.
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