Coating processes – Coating by vapor – gas – or smoke
Reexamination Certificate
2011-06-07
2011-06-07
Barr, Michael (Department: 1711)
Coating processes
Coating by vapor, gas, or smoke
C432S058000, C432S120000, C432S120000, C432S120000, C432S120000, C432S120000, C438S656000, C118S715000, C427S255120, C427S255290
Reexamination Certificate
active
07955646
ABSTRACT:
The amount of atoms diffused into a substrate may be made uniform or the thickness of a thin film may be made uniform in a low species utilization process by stopping the flow of gas into a reaction chamber during the low species utilization process. Stopping the flow of gas into a reaction chamber may entail closing the gate valve (the valve to the vacuum pump), stabilizing the pressure within the reaction chamber, and maintaining the stabilized pressure while stopping the gas flowing into the chamber. Low species utilization processes include the diffusion of nitrogen into silicon dioxide gate dielectric layers by decoupled plasma nitridation (DPN), the deposition of a silicon dioxide film by rapid thermal processing (RTP) or chemical vapor deposition (CVD), and the deposition of silicon epitaxial layers by CVD.
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Cruse James P.
Hegedus Andreas G.
Kuppurao Satheesh
Applied Materials Inc.
Barr Michael
Blakely , Sokoloff, Taylor & Zafman LLP
Bowman Andrew
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