Elimination of etch stop undercut

Details Elimination of etch stop undercut Elimination of etch stop undercut

1990-08-10

1992-06-02

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156651, 156653, 156657, 437228, 437238, 437241, 20419235, H01L 2100

Patent

active

051183820

ABSTRACT:
Two methods for wet etch removing an etch stop layer without leaving an undesired undercut are disclosed. In the first method, a reactive ion etch is stopped on an etch stop layer. The exposed etch stop is wet etch removed, leaving an undesirable undercut. The undercut is filled by chemical vapor deposition of a fill material. The filler is then etched to leave a smooth aperture without undercuts. This last etch may be a sputter etch followed by a plasma etch. In the second method, a reactive ion etch is stopped on an etch stop layer as in the first method. Sacrificial sidewalls are then formed within the aperture. The exposed etch stop layer is then removed by wet etching, the positioning of the sidewalls serving to prevent undercutting of the etch stop layer. Finally, the sacrificial sidewalls are etched.

REFERENCES:
patent: 3861024 (1975-01-01), Napoli et al.
patent: 4315239 (1982-02-01), Daniele et al.
patent: 4354896 (1982-10-01), Hunter et al.
patent: 4631113 (1986-12-01), Donald
patent: 4686000 (1987-08-01), Heath

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