Electrostatic wafer clamp having low particulate contamination o

Details Electrostatic wafer clamp having low particulate contamination o Electrostatic wafer clamp having low particulate contamination o

1998-04-10

1999-10-19

Fleming, Fritz

Electricity: electrical systems and devices

Electric charge generating or conducting means

Use of forces of electric charge or field

279128, H02N 1300

Patent

active

059699345

ABSTRACT:
Apparatus for electrostatic clamping of a workpiece, such as a semiconductor wafer, includes a platen assembly defining an electrically-insulating clamping surface for receiving the workpiece. The platen assembly includes electrodes underlying and electrically isolated from the clamping surface and a dielectric layer between the electrodes and the clamping surface. The dielectric layer may have a periphery which is beveled to define a blunt first edge that forms a boundary of the clamping surface and a second edge that is spaced from the workpiece. A thin, low friction, high hardness dielectric coating may be provided over the dielectric layer. The electrodes may be fabricated of niobium. The disclosed electrostatic wafer clamp provides excellent performance with respect to particulate contamination of the workpiece.

REFERENCES:
patent: 3993509 (1976-11-01), McGinty
patent: 4184188 (1980-01-01), Briglia
patent: 4384918 (1983-05-01), Abe
patent: 4412133 (1983-10-01), Eckes et al.
patent: 4457359 (1984-07-01), Holden
patent: 4480284 (1984-10-01), Tojo et al.
patent: 4502094 (1985-02-01), Lewin et al.
patent: 4520421 (1985-05-01), Sakitani et al.
patent: 4554611 (1985-11-01), Lewin
patent: 4603466 (1986-08-01), Morley
patent: 4645218 (1987-02-01), Ooshio et al.
patent: 4665463 (1987-05-01), Ward et al.
patent: 4692836 (1987-09-01), Suzuki
patent: 4724510 (1988-02-01), Wicker et al.
patent: 4832781 (1989-05-01), Mears
patent: 4938992 (1990-07-01), Mears
patent: 5103367 (1992-04-01), Horwitz et al.
patent: 5166856 (1992-11-01), Liporace et al.
patent: 5179498 (1993-01-01), Hongoh et al.
patent: 5275683 (1994-01-01), Arami et al.
patent: 5315473 (1994-05-01), Collins et al.
patent: 5345999 (1994-09-01), Hosokawa
patent: 5384682 (1995-01-01), Watanabe et al.
patent: 5436790 (1995-07-01), Blake et al.
patent: 5444597 (1995-08-01), Blake et al.
patent: 5452177 (1995-09-01), Frutiger
patent: 5460684 (1995-10-01), Saeki et al.
patent: 5474614 (1995-12-01), Robbins
patent: 5528451 (1996-06-01), Su
patent: 5535090 (1996-07-01), Sherman
patent: 5560780 (1996-10-01), Wu et al.
patent: 5583726 (1996-12-01), Anderson et al.
patent: 5606485 (1997-02-01), Shamouilian et al.
patent: 5612850 (1997-03-01), Birang et al.
patent: 5631803 (1997-05-01), Cameron et al.
patent: 5634266 (1997-06-01), Sherstinsky et al.
patent: 5636098 (1997-06-01), Salfelder et al.
patent: 5644467 (1997-07-01), Steger et al.
patent: 5646814 (1997-07-01), Shamouilian et al.
patent: 5754391 (1998-05-01), Bates
patent: 5812362 (1998-09-01), Ravi
Wardly, George A., "Electrostatic Wafer Chuck for Electron Beam Microfabrication", Rev. Sci. Instrum., vol. 44, No. 10, Oct. 1973, pp. 15-6-1509.

Affiliated with

Also associated with

Rating

Electrostatic wafer clamp having low particulate contamination o does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrostatic wafer clamp having low particulate contamination o, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrostatic wafer clamp having low particulate contamination o will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2064080