Electrostatic discharge protection device for digital...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S355000, C257S362000

Reexamination Certificate

active

11330139

ABSTRACT:
An electrostatic discharge (ESD) device and method is provided. The ESD device can comprise a substrate doped to a first conductivity type, an epitaxial region doped to the second conductivity type, and a first well doped to the first conductivity type disposed in the substrate. The first well can comprise a first region doped to the first conductivity type, a second region doped to a second conductivity type, and a first isolation region disposed between the first region and the second region. The ESD device can also comprise a second well doped to a second conductivity type disposed in the substrate adjacent to the first well, where the second well can comprise a third region doped to the first conductivity type, a fourth region doped to the second conductivity type, and a second isolation region disposed between the third region and the fourth region. Still further, the ESD device can include a first trigger contact and second trigger contact comprising highly doped regions of either conductivity type, the first trigger contact disposed at a junction between the first well and the second well, and the second trigger contact disposed at either well.

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Ker et al., “Substrate-Triggered SCR Device for On-Chip ESD Protection in Fully Silicided Sub-0.25-μm CMOS Process,”IEEE Transaction on Electron Devices, vol. 50, No. 2, Feb. 2003.
Salcedo et al., “Novel and Robust Silicon Controlled Rectifier (SCR) Based Devices for On-Chip ESD Protection,”IEEE Electron Device Letters, vol. 25, No. 9, Sep. 2004.

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