Electrostatic device for holding an electronic component wafer

Details Electrostatic device for holding an electronic component wafer Electrostatic device for holding an electronic component wafer

2006-11-07

2006-11-07

Jackson, Stephen W. (Department: 2836)

Electricity: electrical systems and devices

Electric charge generating or conducting means

Use of forces of electric charge or field

Reexamination Certificate

active

07133273

ABSTRACT:
A device for holding a wafer, an electronic component comprises a system for transporting without deformation a wafer of electronic components. The device also enables the transport by one or the other of the passive or active faces. The device comprises a planar and thin rigid support having a controllable temperature and at least an electrode consisting of (N+1) elements, confined between two sheets of insulating material. The support provides a protrusion-free surface for gripping the wafer, and electrostatic elements for positive retention of the wafer induces a gripping power of the latter distributed over the entire support. The U-shaped support is borne by the electrical bond of the electrode with a remote (adjustable, AC or DC, mono-multipolar) power source. The gripping surface of the device is planar and protrusion-free whatever the geometry of the support used.

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