Electrostatic chuck of semiconductor fabrication equipment...

Electricity: electrical systems and devices – Electric charge generating or conducting means – Use of forces of electric charge or field

Reexamination Certificate

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Reexamination Certificate

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07142406

ABSTRACT:
The present invention relates to an electrostatic chuck having electrodes of which polarities are periodically inverted, and a method for chucking wafers using the electrostatic chuck. The electrostatic chuck of the present invention includes an electrode part including first and second electrodes having different polarities and generating electrostatic charge for fixing a wafer, an electric source part having a first electric source for supplying positive and negative electricity to the respective first and second electrodes and a second electric source for supplying the negative and positive electricity to the respective first and second electrodes, and a polarity inversion part for inverting the polarities of the first and second electrodes every cycle.

REFERENCES:
patent: 4864461 (1989-09-01), Kasahara
patent: 5572398 (1996-11-01), Federlin et al.
patent: 5933314 (1999-08-01), Lambson et al.
patent: 5986874 (1999-11-01), Ross et al.
patent: 6416618 (2002-07-01), Tsuchihashi et al.
patent: 6663973 (2003-12-01), Lee et al.
patent: 2003/0067734 (2003-04-01), Nakano
patent: 4-186863 (1992-03-01), None
patent: 2003-142569 (2003-05-01), None
Mayumi Takahashi, Masatoshi Tsuneoka and Takashi Shimizu: Electrostatic Chuck and Chucking Method: Patent Abstracts of Japan; Publication Date: May 16, 2003; Publication No. 2003-142569; Applicant: Applied Materials Inc.; Japan Patent Office.
Yasushi Sakakibara and Yasutaka Harada; Electrostatic Attracting Equipment; Patent Abstracts of Japan; Publication Date: Jul. 3, 1992; Publication No. 04-186863; Applicant: Fuji Electric Co. Ltd; Japan Patent Office.

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