Electrostatic chuck having bonded structure and method of...

Details Electrostatic chuck having bonded structure and method of... Electrostatic chuck having bonded structure and method of...

2006-03-28

2006-03-28

Sircus, Brian (Department: 2836)

Electricity: electrical systems and devices

Electric charge generating or conducting means

Use of forces of electric charge or field

Reexamination Certificate

active

07019956

ABSTRACT:
An electrostatic chuck and a method for manufacturing the same are provided. The electrostatic chuck has a bonded structure comprising a ceramic electrostatic chuck member, a metal member and a bonding layer. The bonding layer has at least a first outermost bonding layer joined to the ceramic electrostatic chuck member, a second outermost bonding layer joined to the metal member, and an intermediate polyimide layer disposed between the first and second outermost bonding layers. Each of the outermost bonding layers are made of a silicone layer or an acrylic.

REFERENCES:
patent: 4184188 (1980-01-01), Briglia
patent: 5745331 (1998-04-01), Shamouilian et al.
patent: 5798904 (1998-08-01), Guyot
patent: 5835334 (1998-11-01), McMillin et al.
patent: 5867359 (1999-02-01), Sherman
patent: 5870271 (1999-02-01), Herchen
patent: 5909355 (1999-06-01), Parkhe
patent: 6057513 (2000-05-01), Ushikoshi et al.
patent: 6071630 (2000-06-01), Tomaru et al.
patent: 6104596 (2000-08-01), Hausmann
patent: 6108189 (2000-08-01), Weldon et al.
patent: 6256187 (2001-07-01), Matsunaga et al.
patent: 3-3249 (1991-01-01), None
patent: 4-287344 (1992-10-01), None
Dave S. Steinberg, Cooling Techniques for Electronic Equipment, 1991, John Willey & Sons, Inc., 2ndEdition, p. 39.

Affiliated with

Also associated with

Rating

Electrostatic chuck having bonded structure and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrostatic chuck having bonded structure and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrostatic chuck having bonded structure and method of... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3593983