Electrostatic chuck having a multilayer structure for attracting

Electric heating – Metal heating – By arc

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21912144, 21912158, 156345, 279128, B23K 1000

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active

055391796

ABSTRACT:
An electrostatic chuck for electrostatically holding a wafer is provided in a vacuum chamber formed in a magnetron plasma etching apparatus. The electrostatic chuck has a base member, a first insulating layer provided on the base member and made of polyimide, a second insulation layer made of AlN, a conductive sheet provided between first and second insulation layers, and an adhesive layer made of a thermosetting resin and adhering the first insulating layer to the second insulating layer. The wafer is placed on the second insulating layer, and power is supplied from a high voltage power supply to the conductive sheet via a feeding sheet, thereby creating static electricity and hence a coulombic force for holding the wafer on the second insulating layer.

REFERENCES:
patent: 4724510 (1988-02-01), Wicker et al.
patent: 5191506 (1993-03-01), Logan et al.
Patent Abstracts of Japan, vol. 15, No. 383, (E-111), Sep. 27, 1991, & JP-A-3 152 953, Jun. 28, 1991, M. Nakasuji, et al., "Electrostatic Chuck".
Patent Abstracts of Japan, vol. 15, No. 94, (E-104), Mar. 6, 1991, & JP-A-2 304 946, Dec. 18, 1990, K. Tominaga, et al., "Electrostatic Chuck".
Patent Abstracts of Japan, vol. 8, No. 115 (E-247) [1552], May 29, 1984, & JP-A-59 028 354, Feb. 15, 1984, Y. Horiike, et al., "Thin Film for Electrostatic Chuck".
Patent Abstracts of Japan, vol. 14, No. 170, (E-91) Mar. 30, 1990 & JP-A-2 027 748, Jan. 30, 1990, T. Matsunaga, et al., "Electrostatic Chucking Device and Forming Method Therefor".
Patent Abstracts of Japan, vol. 8, No. 268, (E-283)[1705], Dec. 7, 1984, & JP-A-59 139 641, Aug. 10, 1984, M. Nakamura, et al., "Electrostatic Sucker".

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