Electrostatic chuck and the method of operating the same

Details Electrostatic chuck and the method of operating the same Electrostatic chuck and the method of operating the same

1995-12-20

1998-09-29

Fleming, Fritz

Electricity: electrical systems and devices

Electric charge generating or conducting means

Use of forces of electric charge or field

279128, H02N 1300

Patent

active

058153667

ABSTRACT:
An electrostatic chuck, which includes a plurality of ejector pins, means of moving up and down the ejector pins and means of grounding the ejector pins, is provided with an ejector buffer mechanism disposed between the ejector pins and the ejector pin moving means for exerting a buffer action for the tip positions of individual ejector pins. The electrostatic chuck facilitates the positioning control of the ejector pins and enables the ejector pins to come in tight contact with the wafer rear surface, and consequently the wafer can be clamped and released quickly and reliably. At the plasma processing of wafer, the ejector pins are brought to tight contact with the wafer rear surface, or a clearance within a prescribed range is created for the ejector pins from the wafer rear surface, thereby suppressing the occurrence of discharge in the gap between an ejector pin and the wafer rear surface, and consequently problems associated with the discharge can be dissolved.

REFERENCES:
patent: 5179498 (1993-01-01), Hongoh et al.
patent: 5310453 (1994-05-01), Fukusawa et al.
patent: 5382311 (1995-01-01), Ishikawa et al.
patent: 5459632 (1995-10-01), Birang et al.

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