Electrostatic chuck and method of attracting wafer

Details Electrostatic chuck and method of attracting wafer Electrostatic chuck and method of attracting wafer

1996-11-20

1998-07-07

Fleming, Fritz

Electricity: electrical systems and devices

Electric charge generating or conducting means

Use of forces of electric charge or field

279128, H02N 1300

Patent

active

057778388

ABSTRACT:
An electrostatic chuck including an electrode having first and second surfaces, a dielectric member having a first layer for covering at least the first surface of the electrode, a power supply for conducting electric power to the electrode, and a cooling gas-feeding means for feeding a cooling gas onto the surface of the first layer of the dielectric member. A plurality of fine projections 28 are formed on the surface of the first layer of the dielectric member. Each of the fine projections 28 has a tip smaller than a root thereof so as to hold a wafer W in substantially a point-contact manner. The wafer can be held on the surface of the first layer of the dielectric member and cooled by the cooling gas fed from the cooling gas-feeding means.

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