Electrostatic chuck

Electricity: electrical systems and devices – Electric charge generating or conducting means – Use of forces of electric charge or field

Reexamination Certificate

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Details

C501S153000, C501S127000

Reexamination Certificate

active

07907383

ABSTRACT:
The present invention provides an electrostatic chuck in which the surface can be kept smooth after being exposed to plasma, so as to protect a material to be clamped such as a silicon wafer from being contaminated with particles, and which is excellent in clamping and releasing a material to be clamped and easy to manufacture by low-temperature firing. The electrostatic chuck includes a dielectric material in which alumina is 99.4 wt % or more, and titanium oxide is more than 0.2 wt % and equal to or less than 0.6 wt %, wherein the electrostatic chuck's volume resistivity is 108-1011Ωcm in room temperature, and wherein the titanium oxide segregates in boundaries of particles of the alumina.

REFERENCES:
patent: 2002/0190512 (2002-12-01), Abe
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patent: 2000-243820 (2000-09-01), None
patent: 2002-190512 (2002-07-01), None
patent: 2002-203893 (2002-07-01), None
patent: 2004-018296 (2004-01-01), None
patent: 2004-352572 (2004-12-01), None
patent: 2005-033125 (2005-02-01), None
patent: 2006-165107 (2006-06-01), None

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