Electrostatic chuck

Electricity: electrical systems and devices – Electric charge generating or conducting means – Use of forces of electric charge or field

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279128, H02N 1300

Patent

active

059461837

ABSTRACT:
An electrostatic chuck for attracting an object to be treated, includes a substrate, an insulating dielectric layer and at least one electrode provided between the substrate and the insulating dielectric layer, wherein the above object is to be attracted onto the electrode via the insulating dielectric layer and an average thickness of the insulating dielectric layer is not less than 0.5 mm and not more than 5.0 mm.

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patent: 5522131 (1996-06-01), Steger
patent: 5561585 (1996-10-01), Barnes et al.
patent: 5606485 (1997-02-01), Shamouilian et al.
patent: 5631803 (1997-05-01), Cameron et al.
IBM Technical Disclosure Bulletin, vol. 31, No. 1, Jun. 1, 1988, pp. 462-464, XP000119644 "Electrostatic Wafer Holder for Wafer Cooling During Reactive Ion Etching".

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