Electrostatic chuck

Electricity: electrical systems and devices – Electric charge generating or conducting means – Use of forces of electric charge or field

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H02N 1300

Patent

active

057543917

ABSTRACT:
An electrostatic wafer-holding chuck includes first and second dielectric plates formed of single crystal aluminum oxide and at least one electrode disposed within a recess formed in the first dielectric plate. The second dielectric plate has a top wafer-supporting surface that has a fluid distribution network formed therein. The fluid distribution network channels a heat transfer medium to the backside of the wafer. When the first and second dielectric plates are assembled, the first dielectric plate is disposed contiguous to the second dielectric plate and then are diffusively joined together to form a monolithic, hermetically-sealed electrostatic chuck.

REFERENCES:
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patent: 3953174 (1976-04-01), La Belle, Jr.
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patent: 5271274 (1993-12-01), Khuri-Yakub et al.
patent: 5413360 (1995-05-01), Atari et al.
patent: 5426558 (1995-06-01), Sherman
patent: 5436790 (1995-07-01), Blake et al.
patent: 5445709 (1995-08-01), Kojima et al.
patent: 5452177 (1995-09-01), Frutiger
patent: 5452510 (1995-09-01), Barnes et al.
patent: 5535090 (1996-07-01), Sherman
patent: 5600530 (1997-02-01), Smith
Semiconductor International "Electrostatic Chucks in Wafer Processing", (a Cahners Publication, Peter Singer, Senior Editor) Apr. 1995.

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