Electrostatic adhesion tester for thin film conductors

Electricity: measuring and testing – A material property using electrostatic phenomenon – For flaw detection

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324662, 73827, G01R 2726

Patent

active

060022590

ABSTRACT:
A electrostatic adhesion tester for thin film conductors. In one embodiment, a device is provided for testing the adhesion strength of a thin film conductor that has been formed upon a substrate. The device includes an adhesion tester that is primarily comprised of a conducting portion. The conducting portion is applied to the thin film conductor so that it does not physically contact the thin film conductor, but leaves a small space there between. A power supply may further be provided for coupling to either the adhesion tester, the thin film conductor, or both in order to create a potential difference between the conducting portion and the thin film conductor. The potential difference creates an electric field between the conducting portion and the thin film conductor that induces stress in the thin film conductor. A measuring device may also be provided for coupling to the adhesion tester and the thin film conductor in order to measure an electrical parameter of the electric field, which is indicative of the adhesion strength.

REFERENCES:
patent: 5245293 (1993-09-01), Runner
patent: 5432435 (1995-07-01), Strong
patent: 5624625 (1997-04-01), Legressus
English-language abstract for Russian patent No. SU 1805346 published Feb. 11, 1999 (1 sheet); Russian language original (3 sheets); and a certified English Translation (9 sheets).
English-language abstract for Russian patent No. SU 1627931 published Feb. 11, 1991 (1 sheet); Russian language original (3 sheets); and a certified English Translation (7 sheets).
International Search Report for PCT/US 98/06424 dated Feb. 18, 1999.

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