Chemistry: electrical and wave energy – Apparatus – Electrolytic
Reexamination Certificate
1998-08-28
2001-01-16
Valentine, Donald R. (Department: 1741)
Chemistry: electrical and wave energy
Apparatus
Electrolytic
C204S275100
Reexamination Certificate
active
06174417
ABSTRACT:
This invention relates to an electroplating machine, in particular such a machine for electroplating such substrates as printed circuit boards (PCBs).
In conventional electroplating machines, the substrates to be plated, e.g. PCBs, are usually positioned vertically, i.e. with their major surfaces facing sideward. The substrates are clamped either at their respective upper edge or lower edge, and lowered into a tank for treatment, or raised therefrom after such treatment. As a complete electroplating process includes a number of steps, including e.g. rinsing, electroplating, washing, etc., the substrates have to be transported from tank to tank. “Horizontal electroplating machines” have therefore been proposed, in which the substrates are positioned horizontally, i.e. with their major surfaces facing upward and downward. The substrates are caused to move relative to the machine from tank to tank along a substantially horizontal path to undergo the whole electroplating process.
It is an object of the present invention to provide a new horizontal electroplating machine, or at least to provide a useful alternative to the trade. Various other objects of the invention will be apparent from the following discussion.
According to a first aspect of the present invention, there is provided an apparatus for positioning an electrode for electroplating at least one substrate which moves relative to said apparatus, which apparatus comprising a first end and a second end wherein said first end is positionable nearer than said second end to the path of movement of said substrate relative to said apparatus, wherein said first end comprises a first side which is upstream of the movement of said substrate relative to said apparatus, characterized in that said first side curves towards said second end.
According to a second aspect of the present invention, there is provided an apparatus for positioning an electrode for electroplating at least one substrate which moves relative to said apparatus, comprising an end positionable near or adjacent to the path of movement of said substrate relative to said apparatus, said end including a first side which is upstream of, and a second side which is downstream of, the movement of said substrate relative to said apparatus, characterized in that said apparatus comprises at least a first member and at least a second member connecting said first and second sides and that said two connecting members are non-parallel to each other.
According to a third aspect of the present invention, there is provided an apparatus for positioning an electrode for electroplating at least one substrate which moves relative to said apparatus, comprising an end positionable near or adjacent to the path of movement of said substrate relative to said apparatus, said end including a first side which is upstream of, and a second side which is downstream of, the movement of said substrate relative to said apparatus, characterized in that said apparatus comprises at least a first set of plurality of electrically insulating members connecting said first and second sides which are substantially parallel to each other, and that all lines perpendicular to and joining said first and second sides, excluding any part overlapping with one or more of said connecting members, are of substantially the same length.
According to a fourth aspect of the present invention, there is provided a fluid delivery apparatus comprising a pipe member and a nozzle member, wherein said pipe member comprises an inlet for receiving fluid into said apparatus from an external source, and a plurality of holes allowing passing of said fluid into chamber means of said nozzle member, characterized in that said nozzle member comprises a substantially continuous elongated outlet which is in a fluid-communicable relationship with said chamber means, and through which outlet said fluid is deliverable out of said apparatus.
According to a fifth aspect of the present invention, there is provided an apparatus for covering a cylindrical object, which apparatus extending over at least substantially the whole length of said object, and including wall means for shielding at least part of the curved outer surface of said object, and a cavity for receiving at least part of said object, characterized in that said cavity is of a depth at least substantially the same as the diameter of said object for accommodating a majority part of said object, whereby said wall means shields a majority part of the curved outer surface of said object.
According to a sixth aspect of the present invention, there is provided an apparatus for mixing at least one solid chemical with a solution passing therethrough, which apparatus comprising a container with outer wall means, an input end for receiving a solution from an external source into said container, an output end for allowing said solution in said container to depart from said apparatus, and an opening for receiving said chemical into said container, characterized in that said container comprises inner porous wall means defining a cavity to which said solid chemical is receivable, and dividing means positioned between said outer wall means and said inner porous wall means.
According to a seventh aspect of the present invention, there is provided an apparatus for mixing at least one solid chemical with a solution passing therethrough, which apparatus comprising a container with outer wall means and a longitudinal axis, an input end for receiving said solution from an external source into said container, an output end for allowing said solution to exit said apparatus, and an opening for receiving said chemical into said container, characterized in that said container comprises inner porous wall means defining a cavity to which said solid chemical is receivable, and that there are provided on said porous wall means at least a first aperture means and a second aperture means wherein each of said aperture means comprises at least one aperture, wherein the orientation between the longitudinal axis of the aperture of said first aperture means and a plane containing said respective aperture and said longitudinal axis of said container is different from the orientation between the longitudinal axis of the respective aperture of said second aperture means and a plane containing said respective aperture and said longitudinal axis of said container.
According to an eighth aspect of the present invention, there is provided an apparatus for allowing the variation of the distance between a first roller and a second roller, wherein each of said first and second rollers comprises an axle about which each respective roller is rotatable, said apparatus comprising a first body member having a first aperture for receiving at least one end of the axle of said first roller and thereby to allow said axle of said first roller to rotate therein, and a second body member comprising a second aperture for receiving at least one end of the axle of said second roller and thereby to allow said axle of said second roller to rotate therein, characterized in that said first roller is translationally movable relative to said second body member in response to entry of an article between said first and second rollers.
According to a ninth aspect of the present invention, there is provided an electroplating machine comprising one or more apparatus according to one or more of the above aspects of the present invention.
REFERENCES:
patent: 1536569 (1925-05-01), Cruse
patent: 3975242 (1976-08-01), Matsuda et al.
patent: 4102772 (1978-07-01), Nakamura et al.
patent: 4119516 (1978-10-01), Yamaguchi
patent: 4385967 (1983-05-01), Brady et al.
patent: 4459183 (1984-07-01), Brady et al.
patent: 4584066 (1986-04-01), Ando et al.
patent: 4724856 (1988-02-01), Pender
patent: 4747923 (1988-05-01), Oda
patent: 4755271 (1988-07-01), Hosten
patent: 4761213 (1988-08-01), Hosten
patent: 4776939 (1988-10-01), Bl{umlaut over (a)}sing et al.
patent: 4800001 (1989-01-01), Ott et al.
patent: 4832811 (1989-05-01), Hosten
patent: 4846202 (1989-07-01), Kallwe
Colangelo Carl John
Henington Paul
Huang Pin Chun
Lee Chi Chung
Lee Fang Hao
Fish & Neave
Process Automation International Ltd.
Valentine Donald R.
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