Electroplating fixture for high density substrates

Details Electroplating fixture for high density substrates Electroplating fixture for high density substrates

1998-06-23

2000-08-29

Niebling, John F.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438611, 438613, 438614, 438615, 438616, 438617, 22818021, 22818022, 2281805, H01L 2144

Patent

active

061108154

ABSTRACT:
A method of electroplating a high density integrated circuit (IC) substrate using a conductive elastomer including the steps of providing an IC substrate made of nonconductive material having a plurality of conductive traces with conductive trace lands formed on its surface. Covering only the traces (not the trace lands) with a plating resist and exposing portions of the conductive traces. Inserting the IC substrate into a electroplating fixture. Engaging a conductive elastomer to the IC substrate, covering the plurality of conductive traces and electrically connecting all of the traces together. Electroplating the trace lands on the IC substrate with conductive material (such as gold or nickel) by using the conductive elastomer as the electrical connection to the trace lands (via the exposed metal traces). Disengaging the conductive elastomer after electroplating is finished and removing the IC substrate from the electroplating fixture.

REFERENCES:
patent: 5180691 (1993-01-01), Adachi et al.

Affiliated with

Also associated with

Rating

Electroplating fixture for high density substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroplating fixture for high density substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroplating fixture for high density substrates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1249354