Electrooptic assembly

Optical waveguides – Integrated optical circuit

Reexamination Certificate

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Details

C385S032000, C385S033000, C385S088000, C385S089000, C385S093000, C257S183000, C257S200000, C257S676000, C257S678000, C257S680000

Reexamination Certificate

active

07039263

ABSTRACT:
An electrooptic assembly including a microelectronic package and an optical substrate, wherein the optical substrate includes a coupler and a waveguide. An electrooptic element is disposed to convert an electrical signal from the microelectronic package to an optical signal for transmission to the coupler and waveguide, and/or to receive an optical signal and convert it to an electrical signal for transmission to the microelectronic package.

REFERENCES:
patent: 5168537 (1992-12-01), Rajasekharan et al.
patent: 5627931 (1997-05-01), Ackley et al.
patent: 5631988 (1997-05-01), Swirhun et al.
patent: 5905633 (1999-05-01), Shim et al.
patent: 5999670 (1999-12-01), Yoshimura et al.
patent: 6009632 (2000-01-01), Douglas
patent: 6034578 (2000-03-01), Fujita et al.
patent: 6039831 (2000-03-01), Mine et al.
patent: 6271469 (2001-08-01), Ma et al.
patent: 6404960 (2002-06-01), Hibbs-Brenner et al.
patent: 6498358 (2002-12-01), Lach et al.
patent: 6569248 (2003-05-01), Hertz
patent: 6569712 (2003-05-01), Ho et al.
patent: 6809413 (2004-10-01), Peterson et al.
patent: 2001/0013642 (2001-08-01), Jiang et al.
patent: 2002/0028045 (2002-03-01), Yoshimura et al.
patent: 2002/0097962 (2002-07-01), Yoshimura et al.
patent: 2002/0102060 (2002-08-01), Jewell et al.
patent: 2002/0114587 (2002-08-01), Golwalkar et al.
patent: 2002/0114588 (2002-08-01), Golwalkar et al.
patent: 2002/0149636 (2002-10-01), Takabayashi et al.
patent: 2003/0002770 (2003-01-01), Chakravorty et al.
patent: 2003/0016907 (2003-01-01), LoCascio et al.
patent: 2003/0020094 (2003-01-01), Shrauger
patent: 2003/0044157 (2003-03-01), Wickman et al.
patent: 2003/0045403 (2003-03-01), Watterson et al.
patent: 2003/0113974 (2003-06-01), Ning et al.
patent: 2003/0166312 (2003-09-01), Lee
patent: 2003/0185484 (2003-10-01), Chakravorty et al.
patent: 2003/0210531 (2003-11-01), Alcoe et al.
patent: 2003/0210865 (2003-11-01), Johannessen
patent: 2003/0235378 (2003-12-01), Yamaguchi
patent: 2004/0005732 (2004-01-01), Hiatt et al.
patent: 2004/0028875 (2004-02-01), Van Rijn et al.
patent: 2004/0051169 (2004-03-01), Chen et al.
patent: 2004/0052468 (2004-03-01), Pham et al.
patent: 2004/0071387 (2004-04-01), Mule et al.
patent: 2004/0094830 (2004-05-01), Vu et al.
patent: 2004/0264840 (2004-12-01), Mule et al.
patent: WO 01/04671 (2001-01-01), None
International Search Report from PCT/US03/28811, Apr. 2004.
Sadler, et al. “Optical reflectivity of micromachined {111}-oriented silicon mirrors for optical input-output couplers,”J. Micromech. Microeng. 7:263-269 (1997), no month.
Towle, et al., “Bumpless Build-Up Layer Packaging” pp. 25-31 (2001), no month.

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