Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate
2005-04-12
2005-04-12
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
Reexamination Certificate
active
06878643
ABSTRACT:
A peel and stick electronic system comprises a silicone body, and at least one electronic unit operatively connected to the silicone body. The electronic system is produce by providing a silicone layer on a substrate, providing a metal layer on the silicone layer, and providing at least one electronic unit connected to the metal layer.
REFERENCES:
patent: 5346850 (1994-09-01), Kaschmitter et al.
patent: 5395481 (1995-03-01), McCarthy
patent: 5399231 (1995-03-01), McCarthy
patent: 5505321 (1996-04-01), Caron et al.
patent: 5591519 (1997-01-01), Caron et al.
patent: 5644207 (1997-07-01), Lew et al.
patent: 5674758 (1997-10-01), McCarthy
patent: 5817550 (1998-10-01), Carey et al.
patent: 6201980 (2001-03-01), Darrow et al.
patent: 6596569 (2003-07-01), Bao et al.
patent: 20010045362 (2001-11-01), Deng et al.
patent: 20020045030 (2002-04-01), Ozin et al.
patent: 20020050220 (2002-05-01), Schueller et al.
patent: 20020064841 (2002-05-01), Klemic et al.
patent: 20020064909 (2002-05-01), Gracias et al.
patent: WO 0170389 (2001-09-01), None
Benett William J.
Davidson James Courtney
Hamilton Julie K.
Krulevitch Peter A.
Maghribi Mariam N.
Hoang Quoc
Nelms David
Scott Eddie E.
Thompson Alan H.
LandOfFree
Electronic unit integrated into a flexible polymer body does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic unit integrated into a flexible polymer body, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic unit integrated into a flexible polymer body will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3393588